Chee-Lee Heng

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A highly integrated ultra-low-cost high-performance Bluetooth 3.0+EDR SoC is implemented in 0.11m digital CMOS technology. The transceiver has an integrated balun shared between TX and RX, eliminating the need for a separate T/R switch. A 4 LO-based VCO is implemented to reduce LO pulling and to minimize TX out-of-band spurious emissions. The transmitter(More)
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