Charles Effiong

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With technological advances, significant changes are taking place in automotive domain. Modern automobile combines functionalities ranging from safety critical functions such as control systems for engine to navigation and infotainment. To meet the performances requirements of these systems, automotive industry is shifting to multi-core systems. This(More)
Three-dimensional Networks-on-Chip (3D NoCs) are based on Through-Silicon-Vias (TSV), which offer several advantages such as stacking, high throughput and energy efficiency. However, TSVs suffer from design process variations. On the other hand, designing purely asynchronous serializers enables reliable inter-tier communication with moderate performance(More)
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