Charles E Baumgartner

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A low-temperature bonding process for ultrasound transducers is presented: compatible with poling requirements, manufacturability and reliability. In this work, we demonstrate that a thermosonic bonding process can provide a reliable, metallurgical bond at moderate temperatures, even down to room temperature, with bonding times in the order of seconds.(More)
Bonding and integration technologies in ultrasound probes are challenging due to space limitations. Flexible substrates, with the benefits of being bendable, small and allows 3D integration, is an excellent choice for signal transferring in such systems. We have chosen to use anisotropic conductive film (ACF) as interconnection technology and the quality(More)
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