Chaoliang Guan

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Considering the wavefront error of KH(2)PO(4) (KDP) crystal is difficult to control through face fly cutting process because of surface shape deformation during vacuum suction, an error compensation technique based on a spiral turning method is put forward. An in situ measurement device is applied to measure the deformed surface shape after vacuum suction,(More)
Potassium dihydrogen phosphate (KDP) crystals used in high power laser systems require high figure accuracy. Deformation caused by vacuum suction is one of the most significant factors affecting the final surface figure accuracy. It is difficult to compensate the error caused by the suction deformation when using a single point diamond flycutting method.(More)
Hydrodynamic effect polishing (HEP), a noncontact machining process, can realize the processed surface roughness as small as atomic level. To investigate the subsurface structure, the HEP processed quartz glass surface was etched by the hydrofluoric acid solution. It has been proved that HEP is a polishing method with the ability to process the surface with(More)
Combination of the oxidation of reaction-sintered silicon carbide (RS-SiC) and the polishing of the oxide is an effective way of machining RS-SiC. In this study, anodic oxidation, thermal oxidation, and plasma oxidation were respectively conducted to obtain oxides on RS-SiC surfaces. By performing scanning electron microscopy/energy dispersive X-ray(More)
As a newly developed ultrasmooth polishing technique, fluid jet polishing (FJP) has been widely used for optical glass polishing. The size of the particle in the polishing slurry has a great influence on the material removal rate and quality of the processed surface. The material removal mode affected by the particle size is investigated in detail. Particle(More)
Material removal rate has greatly relied on the distribution of shear stress and dynamic pressure on the workpiece surface in hydrodynamic effect polishing (HEP). Fluid dynamic simulation results demonstrate that the higher rotation speed and smaller clearance will cause the larger material removal rate. Molecular dynamic (MD) calculations show the bonding(More)
An ultrasmooth reaction-sintered silicon carbide surface with an rms roughness of 0.424 nm is obtained after thermal oxidation for 30 min followed by ceria slurry polishing for 30 min. By SEM-EDX analysis, we investigated the thermal oxidation behavior of RS-SiC, in which the main components are Si and SiC. As the oxidation rate is higher in the area with(More)
This study will examine the feasibility of applying the hydrodynamic effect to ultrasmooth surface polishing. Differing from conventional pad polishing, hydrodynamic effect polishing is noncontact, as the polishing wheel is floated on the workpiece under the hydrodynamic effect. The material removal mechanism and the removal contour are analyzed in detail.(More)
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