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The sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermo-mechanical deformations, is carried out in this paper to investigate thermal characteristics along with fatigue reliability of board-level thin-profile fine-pitch ball grid array chip-scale packages under coupled power and thermal(More)
In this paper, we evaluate the board-level thermal performance of QFP with an unattached drop-in heat spreader numerically and experimentally. The die is given a power dissipation and induced thermomechanical deformations and the gap distribution on the unattached interface are calculated through the three-dimensional thermal-mechanical coupling analysis(More)
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