Cedrick Chappaz

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In advanced semiconductor devices, most of the reliability issues in interconnect occurs at a very local scale, especially voiding phenomenon in copper lines induced by electromigration. Hence, a better understanding of mechanism governing electromigration is needed for developing more accurate lifetime models. In this paper, finite element simulations are(More)
In part 1 of the current study of haptic displays, a finite element (FE) model of a finger exploring a plate vibrating out-of-plane at ultrasonic frequencies was developed as well as a spring-frictional slider model. It was concluded that the reduction in friction induced by the vibrations could be ascribed to ratchet mechanism as a result of intermittent(More)
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