Cameron Ortega

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A transient electrothermal simulation of a 3-D integrated circuit (3DIC) is reported that uses dynamic modeling of the thermal network and hierarchical electrothermal simulation. This is a practical alternative to full transistor electrothermal simulations that are computationally prohibitive. Simulations are compared to measurements for a token-generating(More)
Genome assemblers to date have predominantly targeted haploid reference reconstruction from homozygous data. When applied to diploid genome assembly, these assemblers perform poorly, owing to the violation of assumptions during both the contigging and scaffolding phases. Effective tools to overcome these problems are in growing demand. Increasing parameter(More)
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