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Development of improved photosensitive polycarbonate systems for the fabrication of microfluidic devices
- C. E. White, C. Henderson
- Engineering, Chemistry
- 9 December 2003
A technique was recently developed for the fabrication of microfluidic devices that involves using thermally sacrificial polymeric materials in conjunction with other conventional microelectronic…
Fabrication of microchannels using polycarbonates as sacrificial materials
- H. Reed, C. E. White, V. Rao, S. Allen, C. Henderson, P. Kohl
- Materials Science, Engineering
- 1 November 2001
The use of polycarbonates as thermally decomposable, sacrificial materials for the formation of microchannels is presented. Polycarbonates decompose in the temperature range of 200-300 °C. Two…
Synthesis and characterization of photodefinable polycarbonates for use as sacrificial materials in the fabrication of microfluidic devices
- C. E. White, C. Henderson
- Engineering, Materials ScienceSPIE Advanced Lithography
- 15 July 2002
A fabrication technique recently developed at Georgia Institute of Technology involving thermally sacrificial polymeric materials allows for fabrication of microfluidic devices with greater degrees…
Effects of the photoacid generator type on the imaging and thermal decomposition properties of photodefinable, thermally sacrificial poly(propylene carbonate) materials
- C. E. White, A. Balogun, C. Henderson
- Engineering
- 5 October 2006
Photosensitive, thermally sacrificial polymer systems consisting of poly(propylene carbonate) (PPC) and a photoacid generator (PAG) were studied for use in the fabrication of buried microchannel…
Photosensitive copolycarbonates for use as sacrificial materials in the fabrication of microfluidic and microelectromechanical devices
- C. E. White, C. Henderson
- EngineeringSPIE Advanced Lithography
- 14 May 2004
In the rapidly growing field of microfluidics, there is a tremendous need for alternative fabrication processes and for simple methods to integrate higher levels of functionality into microfluidic…
Phase diagrams of indium alloys and their engineering applications
- C. E. White, 岡本 博明
- Materials Science
- 1992
Microsystems manufacturing via embossing of photodefinable thermally sacrificial materials
- C. E. White, T. Anderson, C. Henderson, H. Rowland, W. King
- Materials Science, EngineeringSPIE Advanced Lithography
- 20 May 2004
Substantial recent interest in microelectronics manufacturing has motivated significant work on non-traditional processes such as embossing-based lithography. This work has been generally limited to…
HOW TO USE FUSIBLE ALLOYS
- C. E. White, J. Ferriter
- Materials Science
- 1990
Fusible alloys are materials that melt at less then 149°C (300°F), well below the melting point of tin-lead eutectic solders and SAC alloys. Bismuth is the major component of many of these alloys and…
Indium: high technology metal
- C. E. White
- Materials Science
- 1986
Curiosite de laboratoire il y a 60 ans, etapes de son developpement industriel et premiers producteurs, utilisations importantes dans les transistors a germanium (1946), comme produit d'apport de…
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