C. W. Tan

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Anisotropic conductive films (ACFs) received a great deal of attention in recent years for interconnection applications in electronic packaging. This paper reports the behaviour of ACF joints under various mechanical loading, i.e., die shear and cyclic fatigue in shear. The mechanical behaviour of ACF joints that have been exposed to environmental effects,(More)
In this work the effect of different bonding temperatures on the thermal stability of anisotropic conductive films (ACFs) was investigated. A thermogravimetric analyzer (TGA) was utilized to determine the thermal decomposition temperature of ACF. The experimental results showed that the temperature for maximum decomposition rate of ACF, T m decreased with(More)
This paper reports that the stress-corrosion cracking induced by autoclave test condition reduces the mechanical strength of anisotropic conductive joints and also increases the contact resistance by allowing more moisture to reach the aluminium metallization. The use of anisotropic conductive joints with bumpless chips allows a reduction in the costs of(More)
The demand for volume deployment of photonic components has increased, and with it the need to effectively manufacture in a reproducible and cost effective way. Therefore, it is important to keep the assembly process consistent and stable. A simple shear test setup was used in this study to determine the shear force that can be used as an instant indicator(More)
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