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The paper presents a new silicon wafer bonding technique. The high-resolution bonding pad is defined through pho-tolithography process. Photosensitive materials with patternable characteristics are served as the adhesive intermediate bonding layer between the silicon wafers. Several types of photosensitive materials such as SU-8 (negative photoresist),(More)
Out-of-plane polyimide (PI) electromagnetic microactuators with different geometries are designed, fabricated and tested. Fabrication of the electromagnetic microactuators consists of 10 lm thick Ni/Fe (80/20) permalloy deposition on PI diaphragm by electroplating process, electroplating of copper planar coil with 10 lm thick, bulk micromachining, and(More)
In this study, the authors experimentally investigate the performance of the organic Rankine cycle (ORC) and screw expander under the influence of supply pressure and pressure ratio over the expander. Three tests were performed with expander pressure ratios of 2.4–3.5, 3.0–4.6, and 3.3–6.1, which cover the over-expansion and under-expansion operating modes.(More)
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