C.-J R. Shi

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This paper presents the characterization of inversion coefficient and technology current for 14nm FinFET. Analog performance parameters, their variability and controlability, including transconductance efficiency, intrinsic gain, gain-bandwidth product, flicker noise and current mismatching, are then characterized in terms of inversion coefficient. These(More)
The ion beam-enhanced adhesion of thin Au films on vitreous silica ;ubstrates "as studied for a wide range of Cl ion beam doses for beam energies between 6.5 MeV and 21.0 MeV. Since the residual adhesron of Au on Si02 is low. the improved adhesion can be easily seen using the Scotch Tape Test. The threshold in the enhanced adhesion corresponding to passing(More)
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