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Copper wires are increasingly used in place of gold wires for making bonded interconnections in microelectronics. There are many potential benefits for use of copper in these applications, including better electrical and mechanical properties, and lower cost. Usually, wires are bonded to aluminum contact pads. However, the growth of Cu/Al intermetallic(More)
Since the 50Sn32Pb18Cd eutectic solder was melted at 145 °C which is lower than the melting point of 63Sn37Pb solder (183 °C), it was selected as the interconnection joint to create a temperature gradient to avoid the former nearby 63Sn37Pb joint re-melted during the components assembly process. The tensile testing and the microstructure(More)
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