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Tape and reel packaging process is one of the important final manufacturing process of electric chip. During and after this packaging process, the defects of chips in the tape and reel package should be inspected. It is so time and cost consuming task by human inspectors. The main defects of chip in the tape and reel package are orientation chip, a wrong(More)
This paper proposes a low-power dynamically adaptive distance measurement technique for ultrasonic (US) pen digitizers. The technique utilizes a new clock frequency-throttling technique for a reconfigurable analog front-end in implementing a frequency-hopping scheme to minimize power dissipation. As a result, a noise-tolerant distance measurement which is(More)
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