C. Diao

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This work studies the electromigration of solder joints in an encapsulated copper post wafer level package (WLP) by finite element modeling. Experimental data showed that the electromigration failure occurs in solder joints on the printed circuit board (PCB) side due to the current crowding. In order to improve the electromigration performance on the PCB(More)
Ba<sub>0.4</sub>Sr<sub>0.6</sub>TiO<sub>3</sub> (BST) thin films were prepared by spin-coating technique and deposited on either Pt/TiO<sub>2</sub>/SiO<sub>2</sub>/Si (Pt/Si) substrate or silicon buffered by a lanthanum nickel oxide buffer layer (LNO/Si). X-ray diffraction and scanning electron microscopy showed that the BST films were crack free, compact(More)
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