C. Buttay

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Silver sintering die attach is a promising technology for high temperature power electronics packaging. In this paper, we evaluate its performances in terms of thermal resistance and high temperature stability. The thermal resistance is measured on test vehicles assembled under different conditions, using silver pastes from NBETech and Heraeus, with(More)
Pure molybdenum powder was sintered using Spark Plasma Sintering under various temperatures, and holding times, under a pressure of 77 MPa and a heating rate at 700°C/min. After sintering, a carbide layer was observed at the surface. The carbide layer thickness, the relative density of the sample as well as the microhardness and the grain size of Mo were(More)
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