C. Basaran

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Accurate prediction of the thermomechanical cyclic behavior of joints and interfaces in semiconductor devices is essential for their reliable design. In order to understand and predict the behavior of such interfaces there is a need for improved and unified constitutive models that can include elastic, inelastic, viscous, and temperature dependent(More)
The finite element procedure with the unified disturbed state modeling concept presented in Part I, Basaran et al. (1998), is verified here with respect to laboratory test results for Pb40/Sn60 eutectic solder alloy. This solder alloy is a commonly used interconnection material for surface mount technology packages. It is demonstrated that the proposed(More)
—A unified constitutive modeling approach based on the disturbed state concept (DSC) provides improved characterization of thermomechanical response of joining (solders), ceramics and printed wire board (PWB) materials in electronic packaging. Various versions in the DSC approach are calibrated and validated with respect to laboratory test data, and are(More)
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