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Stereo matching is one of the most active research areas in intelligent vehicle technology. In order to apply the stereo matching to intelligent vehicles, it must generate high-accuracy three-dimensional information in real time. For real-time stereo matching, this paper proposes a sparse multi-window method which not only gives robustness to noise but also(More)
This paper presents comprehensive design and analysis results of 3D IC-based low-power stereo matching processors. Our design efforts range from architecture design and verification to RTL-to-GDSII design and sign-off analysis based on GlobalFoundries 130-<i>nm</i> PDK. We conduct comprehensive studies on the area, performance, and power benefits of our 3D(More)
In this paper, we propose a new stereo matching hardware architecture based on the AD-Census stereo matching algorithm that produces accurate disparity map. The proposed stereo matching hardware architecture is fully pipelined and processes images with disparity level parallelism in real time. Also, it uses modulo memory addressing methods for reducing the(More)
The main objective of fog removal algorithm is to estimate the airlight map for the given image and then perform the necessary operations on the image in order to overcome the fog in the image and enhance the quality of the image. The dark channel prior method of fog removal is more suitable and time-saving in real-time systems. In this paper, an efficient(More)
—This paper presents comprehensive design and analysis results of 3D IC-based low-power stereo matching processors. Our design efforts range from architecture design and verification to RTL-to-GDSII design and sign-off analysis based on GlobalFoundries 130-nm PDK. We conduct comprehensive studies on the area, performance, and power benefits of our 3D IC(More)
Recently, stereo matching processors have been adopted in real-time embedded systems such as intelligent robots and autonomous vehicles, which require minimal hardware resources and low power consumption. Meanwhile, thanks to the through-silicon via (TSV), three-dimensional (3D) stacking technology has emerged as a practical solution to achieving the(More)