Byoung-Joon Kim

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OBJECTIVES It was suggested that glucocorticoid exerts cell-specific effects on thyrotropin-releasing hormone (TRH) gene expression at the transcriptional level. Although there is no typical palindromic glucocorticoid response element (GRE) on the rat TRH gene promoter, a perfect GRE half-site is found between -205 bp and -211 bp. We investigated whether(More)
OBJECTIVE To investigate the influence of pregnancy on patients with neuromyelitis optica spectrum disorder (NMOSD). METHODS A total of 190 women with NMOSD were enrolled from 7 referral hospitals in 4 countries. We reviewed medical records and used a structured questionnaire to investigate gravidity, parity, and the number of relapses during the 2 years(More)
3-Deazaadenosine (DZA), one of the potent inhibitors of S-adenosylhomocysteine hydrolase, is known to possess several biological properties including an induction of apoptosis. To evaluate a possibility that DZA may be utilized for the treatment of human leukemia, we studied molecular events of cell death induced by DZA in human leukemia HL-60 and U-937(More)
Atopic myelitis is defined as myelitis with atopic diasthesis but the cause is still unknown. Toxocariasis is one of the common causes of hyperIgEaemia that may lead to neurologic manifestations. The purpose of this study was to evaluate the sero-prevalence of Toxocara specific IgG Ab among the atopic myelitis patients. We evaluated the medical records of(More)
The electrical resistance Cu film on flexible substrate was investigated in cyclic bending deformation. The electrical resistance of 1 µm thick Cu film on flexible substrate increased up to 120 % after 500,000 cycles in 1.1 % tensile bending strain. Crack and extrusion were observed due to the fatigue damage of metal film. Low bending strain did not(More)
The intermetallic compound (IMC) growths of Cu pillar bump with shallow solder (thin Sn thickness) were investigated during annealing or current stressing condition. After reflow, only Cu<inf>6</inf>Sn<inf>5</inf> was observed, but Cu<inf>3</inf>Sn formed and grew at Cu pillar/Cu<inf>6</inf>Sn<inf>5</inf> interface with increasing annealing and current(More)
Cu pillar bumps with eutectic SnPb solder were annealed and their microstructures were investigated. Linear relationship was observed between thickness of intermetallic compounds (IMCs: Cu<sub>6</sub>Sn<sub>5</sub>, Cu<sub>3</sub>Sn) and square root of time at 120 and 150degC. Kirkendall voids, formed by the diffusivity differences between Cu and Sn, were(More)