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Non-Conductive Adhesive (NCA) Trapping Study in Chip on Glass Joints Fabricated Using Sn Bumps and NCA
Chip-on-glass (COG) bonding using a nonconductive adhesive (NCA) and the entrapment of NCA and fillers in the COG joints were studied. Sn was used as a bump material because it has a higherExpand
Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives
TLDR
We have developed a reliable and ultra-fine pitch chip on glass bonding technique using Sn/Cu bumps and non-conductive adhesive (NCA) using a thermo-compression bonder. Expand
The Reliability of 30 μm pitch COG joints fabricated using Sn/Cu bumps and non-conductive adhesive
We developed a reliable and ultra-fine pitch chip on glass (COG) bonding technique using non-conductive adhesive (NCA). Sn was used as a bump material because it has a high plastic deformationExpand
The Effect of Fillers in Nonconductive Adhesive on the Reliability of Chip-on-Glass Bonding with Sn/Cu Bumps
The effect of a nonconductive adhesive (NCA) on the reliability of chip-on-glass (COG) bonding was studied. Double layer bumps consisting of dome-shaped Sn on Cu columns were formed by electroplatingExpand
Development on integrated passive devices using wafer level package technologies
In recent years, as the demand for ever-smaller electronic systems grows, Industry trends are seeking ways to increase IC integration levels and to reduce the size and weight of IC packages. TheExpand
3D SiP module using TSV and novel solder bump maker
In this paper, a 3D system in package (SiP) module using through silicon vias (TSV) and novel solder bump maker (SBM) has been presented. The SBM is a paste material which is composed of the solderExpand
Development on Silicon module with Cu-filled TSV and Integrated Passive Devices
In recent years, market demands on more functionality, smaller form factor and higher speed is becoming strong increasingly. In order to come up with those, many new technologies are emerging in theExpand