Bryce Rasmussen

Learn More
Population density can have profound, often negative effects on fitness-related traits and population dynamics, and density dependence is of central importance to many prominent ecological and evolutionary hypotheses. Here, we used experimental manipulations of food, population density, and water conditioning to characterize the mechanisms underlying(More)
  • Stevan Hunter, Jose Martinez, Cesar Salas, Marco Salas, Steven Sheffield, Jason Schofield +4 others
  • 2012
(This is part 2, continued from " Use of harsh Wafer Probing to Evaluate Traditional Bond Pad Structures "). Goals for circuit under pad (CUP) in aluminum – silicon dioxide (Al – SiO 2) based IC pad structures include the design of metal interconnects in all layers beneath the pad Al, and the ability to withstand harsh probing and wirebonding stress without(More)
Economic challenges for small size IC design and manufacturing require: reduced die size without adding layers or other costs, bonding with Cu wire instead of Au wire, and maintained or improved reliability. Die size shrinking involves extensive use of circuit under pad (CUP) or bond over active circuitry (BOAC) on IC's having at least two levels of metal.(More)
  • 1