Brice Achkir

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Through-silicon-via (TSV) enables vertical connectivity between stacked chips or interposer and is a key technology for 3-D integrated circuits (ICs). While arrays of TSVs are needed in 3-D IC, there only exists a frequency-dependent resistance, inductance, conductance and capacitance circuit model for a pair of TSVs with coupling between them. In this(More)
Characterizing materials used in Printed Circuit Board (PCB) manufacturing is becoming increasingly important in link path analysis as the data rates are increasing. The material properties governing the performance of the signal passing through a transmission line are frequency-dependent. Using frequency-domain vector network analyzer (VNA) measurements(More)
Identifying the dominant inductance in power distribution network design for multi-layer printed circuit boards that use power net area fills is essential. The plane-Pair partial element equivalent circuit method is used herein to extract a lumped inductance suitable for a physics-based circuit model for power net area fills. The method is being applied for(More)
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