Brice Achkir

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—Through-silicon-via (TSV) enables vertical connec-tivity between stacked chips or interposer and is a key technology for 3-D integrated circuits (ICs). While arrays of TSVs are needed in 3-D IC, there only exists a frequency-dependent resistance, inductance, conductance and capacitance circuit model for a pair of TSVs with coupling between them. In this(More)
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