Bonn Schmaltz

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  • Bonn Schmaltz
  • 2013 IEEE International Symposium on Advanced…
  • 2013
The age of advanced mobile devices is on the direct horizon, are we ready for it? Less power consumption, faster processing, high reliability, high yield, low cost are words engineers are all too familiar with. 2.5/3D utilizing interposer technology, Thru Silicon Via (TSV), sub-50μm die thickness are a few of the latest techniques engineers use to(More)
After artificial insemination and multiple ovulation and embryo transfer (MOET), in vitro production of embryos (IVP) represents the third generation of techniques aimed at a better control of animal reproduction. This technique involves four major steps (Figure 1): oocyte collection, oocyte in vitro maturation (IVM), in vitro fertilization (IVF) and in(More)
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