Bernd Roelfs

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This article describes a new tool and process for Cu electroplating on power chips. The tool enables a new, more efficient method for embedding power chips by means of simultaneous electroplating on both sides of the wafer. Additional tool features, to be discussed in this article, provide technical benefits for embedded technologies and enable further(More)
This paper presents systematic investigations on complete through hole filling for cores using a Cu electroplating process as an alternative to the common paste plugging process [1]. This technology is targeting at both HDI production and also at the packaging level [2]. This electro plating process consists of two steps, a first process to merge both(More)
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