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The migration issue of Package-on-Package (PoP) is investigated in this article. The migration phenomenon can be amplified as the density of solder bumps increases, while the paths are very finer as well in PoP.
Presented is a process for thin film molecularly imprinted polymer (MIP) coating based on commercial nucleotides adenosine monophosphate (AMP). The compatibility of the MIP film with acoustic propagation and sensor sensitivity for rebinding of AMP have been verified. Thin and porous layers of AMP-based MIP layers were successfully deposited on the sensor… (More)
Cancer is a leading cause of death worldwide and actual analytical techniques are restrictive in detecting it. Thus, there is still a challenge, as well as a need, for the development of quantitative non-invasive tools for the diagnosis of cancers and the follow-up care of patients. We introduce first the overall interest of electronic nose or tongue for… (More)
The thermally-induced deformations of package-on- package (POP) are investigated theoretically, numerically and experimentally in this paper. An analytical model of POP is newly proposed for prediction of the warpage of POP, which can be achieved by solving a few linear multiple polynomial equations rather than building a complex model in ANSYS, and leads… (More)