Benedikt Ripka

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This paper reports on possible interconnect solutions between a Silicon MMIC and an off-chip antenna. These shall both be integrated within a plastic package to achieve a 122 GHz system-in-package. Coplanar wire bond and flip chip interconnects are shortly introduced and compared. Simulation and measurement results of matched interconnects are then(More)
The final prototype covers a bandwidth of 20:1 and has a stable pattern over frequency. The antenna will be used in a high-voltage pulse system consisting of a linear array fed by a true-time delay beamformer [4]. Concerning open literature, there is no other Vivaldi antenna covering this frequency band for anti-electronics HPEM systems.
This paper introduces the idea of a low-cost surface-mountable millimeter-wave radar sensor. Different packaging topologies are compared with the aim of realizing a complete system-in-package. Finally, two different possibilities of interconnecting a Silicon MMIC with an off-chip antenna are evaluated based on simulations and measurements within the(More)
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