Bartosz Maj

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The paper describes thermal modeling with coupled network models by means of a typical optimization process for semiconductor products. This becomes especially important in automotive applications with small thermal budgets. Using two different module configurations, the entire modeling process is discussed in detail. The approach with boundary condition(More)
The subject of this work is the calculation of the temperature distribution in ASICs, generated by rectangular sources at the top surface of the ASIC while the backside of the substrate is held at a fixed temperature. Using conformal mapping, the steady state temperature distribution generated by surface sources of variable width in ASICs of variable(More)
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