Balaji Vaidyanathan

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Interconnect is one of the major concerns in current and future microprocessor designs from both performance and power consumption perspective. The emergence of three-dimensional (3D) chip architectures, with its intrinsic capability to reduce the wire length, is one of the promising solutions to mitigate the interconnect related issues. In this paper we(More)
Random process variation and variability intrinsic to PMOS Negative Bias Temperature Instability (NBTI-induced statistical variation) are two major reliability concerns as transistor dimensions scales with technology. Previous works have studied these two sources of variation separately at device and circuit level. We study the impact of the interaction(More)
Code compression techniques have been proposed to mitigate the problem of limited memory resources in embedded systems. As technology scales, reducing on-chip bus energy consumption is becoming important for embedded system designers. In this paper, we propose a crosstalk-aware energy-efficient code compression scheme, which can reduce inter-wire coupling(More)
— On-chip decoupling capacitors (Decaps) are widely used to mitigate on-chip power supply noise. At and below 100nm on-chip decaps face leakage and area overhead problems associated with it and is estimated to increase with technology scaling. A recent work has proposed a gated decap structure to reduce leakage in decaps. Their work analyzes leakage saving(More)
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