Balagopal Mayampurath

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There has been an ongoing trend to require transceivers for use in datacom and telecom switches to be small and have low power dissipation to enable large port count switches. At speeds between 1 and 4 GBaud the SFP form factor is by far the most commonly used. Up to now 10 GBaud transceivers have used larger devices with larger power dissipations. This(More)
A 12-channel, 2.5 Gb/s, receiver IC for parallel optical interconnect is described. Each channel contains a Metal-Semiconductor-Metal Photodetector (MSM PD), Transimpedance Amplifier (TIA), Limiting Amplifier (LA), Output Buffer (OB) and Loss of Signal Detector (LOS). The chip was designed and fabricated in a 0.4 /spl mu/m GaAs MESFET process. Using a 3.3 V(More)
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