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The advent of broadband services requires multi service provisioning platforms (MSPP) to achieve >10Gbps capacity with 1-4 rack unit footprint, power <200W and cost <$10K. Highly integrated SoC using 0.13mu CMOS 19.3times19.3mm die packaged in a 1517 FCBGA affords a unique MSPP solution consisting of 155M-10Gbps SONET/SDH framing, low/high order(More)
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