Azrina Talik

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UNLABELLED The interfacial properties between electrodes and the various organic layers that comprise an organic electronic device are of direct relevance in understanding charge injection, extraction and generation. The energy levels and energy-bending of three interfaces; indium tin oxide (ITO)/poly(3,4-ethylenedioxythiophene) polystyrene sulfonate ( (More)
The increased use of area-array technology in electronic packaging recently has given greater importance to the manufacturers of predicting the thermal distribution of area-array solder interconnection. As the interconnection technology for flip chip package is getting finer and smaller and the shape of solder join becomes complex, it is extremely difficult(More)
This paper discusses the formation of organic residues on high lead (Pb) Flip Chip Ball Grid Array (FCBGA) package. Flux used for Control Collapse Chip Connection (C4) die attachment during assemblies could remain on the die surface as organic residues, thus affecting the Integrated Circuit (IC) performance. Therefore, the effect of implementation(More)
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