Aymen Fradi

We don’t have enough information about this author to calculate their statistics. If you think this is an error let us know.
Learn More
TSV or interconnect between chips have as a promising solution for overcoming interconnect and power bottlenecks in 3D IC. However, testing of 3D ICs remains a significant challenge, and breakthroughs in test technology are needed to make 3D integration commercially viable. This paper first presents an overview of TSV-related defects and the impact of TSVs(More)
  • 1