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<?Pub Dtl?>A first fully integrated 5.2-GHz CMOS-based RF power harvester with an on-chip antenna is presented in this paper. The design is optimized for sensors implanted inside the eye to wirelessly monitor the intraocular pressure of glaucoma patients. It includes a five-stage RF rectifier with an on-chip antenna, a dc voltage limiter, two voltage(More)
There is a growing need for small size integrable phased antenna arrays for emerging satellite communications on-the-move applications. Traditional ferrite-based phase shifters are generally bulky due to the need of electromagnets for biasing, yielding them unsuitable for this kind of application. In this paper, a novel compact light-weight substrate(More)
The paper presents design of three different fractal antennas in Low Temperature Co-fired Ceramic (LTCC) substrate. An aperture coupled feeding technique has been used in all the three designs which is highly suitable for multi-layer system on package (SoP) concept. The three fractal designs demonstrated are Sierpinski carpet fractal antenna, Sierpinski(More)
An inkjet-printed, fully passive sensor capable of either humidity or gas sensing is presented herein. The sensor is composed of an interdigitated electrode, a customized printable gas sensitive ink and a specialized dipole antenna for wireless sensing. The interdigitated electrode printed on a paper substrate provides the base conductivity that varies(More)
Inkjet printing has emerged as an ideal method for the fabrication of low cost and efficient electronic systems. However, most of the printed designs at present utilize 2D inkjet printing of metallic inks on conventional substrates. In order to have fully printed RF components, the substrate must also be printed. 3D printing of polymers can be an ideal(More)
—In this work, a library of 3D lumped components completely embedded in the thinnest, multilayer liquid crystal polymer (M-LCP) stack-up with four metallization layers and 100 µm of total thickness, is reported for the first time. A vertically and horizontally interdigitated capacitor, realized in this stack-up, provides higher self resonant frequency as(More)
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