Ashish Gupta

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This paper proposes a new thermal nonlinear modeling technique for packaged integrated systems. Thermal behavior of complicated systems like packaged electronic systems may exhibit nonlinear and temperature dependent properties. As a result, it is difficult to use a low order linear model to approximate the thermal behavior of the packaged integrated(More)
Temperature estimation and prediction are critical for online regulation of temperature and hot spots on today's high performance processors. In this paper, we present a new method, called FRETEP, to accurately estimate and predict the full-chip temperature at runtime under more practical conditions where we have inaccurate thermal model, less accurate(More)
Efficient temperature estimation is vital for designing thermally efficient, lower power and robust integrated circuits in nanometer regime. Thermal simulation based on the detailed thermal structures no longer meets the demanding tasks for efficient design space exploration. The compact and composable model-based simulation provides a viable solution to(More)
Accurate runtime power estimation is important for on-line thermal/power regulation on today's high performance processors. In this paper, we introduce a power calibration approach with the assistance of on-chip physical thermal sensors. It is based on a new error compensation method which corrects the errors of power estimations using the feedback from(More)
In this paper, we propose a new behavioral thermal modeling technique for high-performance microprocessors at package level. Firstly, the new approach applies the subspace identification method with the consideration of practical power maps with correlated power signals. We show that the input power signal needs to meet an independence requirement to ensure(More)
Efficient temperature estimation is critical for designing thermal efficient, low power and robust integrated circuits in nanometer regime. Thermal simulation starts from the detailed thermal structures by solving thermal diffusion equations no longer meets demanding tasks for efficient design space exploration. Compact and composable model-based simulation(More)
This paper proposes a new thermal modeling method for package design of high-performance microprocessors. The new approach builds the thermal behavioral models from the given accurate temperature and power information by means of the subspace method. The subspace method, however, may suffer predictability problem when the practical power is given as a(More)
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