Highly Influential Citations6
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Reliability and Electromigration Degradation of GaAs Microwave Monolithic Integrated Circuits (A. Christou). Simulation and Computer Models for Electromigration (P. Tang). Temperature Dependencies on… Continue Reading
There has been significant research on graphene as a sensor owing to the inherent high sensitivity and surface area associated with two-dimensional (2D) materials. Often, the ability of graphene to… Continue Reading
The next paradigm shift in display technology involves making them flexible, bringing with it many challenges with respect to product reliability. To compound the problem, industry is continuously… Continue Reading
Numerical simulations of the two-dimensional temperature distribution for a typical GaAs MMIC circuit were conducted in order to understand the heat conduction process of the circuit chip and to… Continue Reading
The 23 papers in this special issue focus on gallium nitride and related nitride compounds device reliability. The main emphasis in this issue is on the reliability of HFETs and LEDs.
Reliability and performance concerns of GaAs microwave monolithic integrated circuits general reliability considerations as applied to MMICs monolithic microwave integrated circuit reliability… Continue Reading
Advanced applications of AlGaN/GaN high-electron-mobility transistors (HEMTs) in high-power RF and power switching are driving the need for insulated gate technology. We present a… Continue Reading
Abstract Low noise GaAs based metal semiconductor field effect transistors (MESFETs) and high electron mobility field effect transistors (HEMTs) are subjected to temperature accelerated testing in… Continue Reading
Abstract The temperature stability and high temperature characteristics of GaAs FETs on CVD diamond heat sinks were investigated by modeling the high-temperature electrical characteristics for GaAs… Continue Reading
Solder plays a critical role in packaging because it serves several functions including electrical contacts, mechanical support, adhesion, and signal interconnections. In an attempt to reduce both… Continue Reading