Anh-Vu H. Pham

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In this paper, we present the design and development of thin-film liquid-crystal-polymer (LCP) surface-mount packages for Ka-band applications. The packages are constructed using multilayer LCP films and are surface mounted on a printed circuit board (PCB). Our experimental results demonstrate that the package feed-through transition including a PCB launch(More)
S. J. B. Yoo,* J. P. Heritage, V. J. Hernandez, R. P. Scott, W. Cong, N. K. Fontaine, R. G. Broeke, J. Cao, S.-W. Seo, J.-H. Baek, F. M. Soares, Y. Du, C. Yang, W. Jiang, K. Aihara, Z. Ding, B. H. Kolner, Anh-Vu Pham, Shu Lin, F. Olsson, S. Lourdudoss, K. Y. Liou, S. N. G. Chu, R. A. Hamm, B. Patel, W. S. Hobson, J. R. Lothian, S. Vatanapradit, L. A.(More)
We demonstrate a compact monolithically-integrated InP optical arbitrary waveform generator, consisting of an arrayed waveguide grating pair with 10 GHz channel spacing, 10 high-speed optical amplitude modulators, and 10 high-speed optical phase modulators. 1. Introduction Line-by-line pulse shaping [1], in which intensity and phase manipulation of(More)
We present the design and development of an organic package that is compatible with fully released RF microelectromechanical systems (MEMS). The multilayer organic package consists of a liquid-crystal polymer film to provide near hermetic cavities for MEMS. The stack is further built up using organic thin-film polyimide. To demonstrate the organic package,(More)
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