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Mechanical parts with complex geometry features, especially free-form surfaces, are being used widely in the industry. Digital manufacturing techniques have recently been developed to manufacture free-from surfaces with high quality and low cost. In this paper, an integrated digital manufacturing strategy is presented, in which free-form surface are(More)
Globalization, collaboration and competition are forcing product realization processes to become faster and more distributed. The requirements for higher eficiency, lower cost, and better product quality lead to challenges in the design of a product realization process in which concurrency and distribution are important. A distributed process structuring(More)
In a product design and analysis process, engineers have different usage views towards product information models. The heterogeneous transformation problem has been presented to characterize the resulting gap between design models and analysis models. The multi-representation architecture (MRA) has been developed to realize this transformation through four(More)
Design for manufacturing is often difficult for mechanical parts since significant manufacturing knowledge is required to adjust part designs for manufacturability. The traditional trial and error approach usually leads to expensive iterations and compromises the quality of the final design. The authors believe the appropriate way to handle product design(More)
Some of the most significant challenges in automated CAD–FEA integration are information and model transformations between CAD and FEA tools. These are especially labor-intensive and time-consuming in a newly characterized class of problems termed highly coupled variable topology multi-body (HCVTMB) problems. This paper addresses these challenges with a(More)
In the electronic chip package development process, Finite Element Analysis (FEA) modeling is widely used as a virtual prototyping technology to achieve good designs. Due to the complexity and variability in materials, geometric shapes, and connectivity configurations, etc. in a chip package, FEA modeling is a tedious and time-consuming activity. Typically(More)
** Corresponding Author Phone: 404-894-7572; Fax: 404-894-9342 Email: russell.peak@marc.gatech.edu ABSTRACT As engineering systems are increasingly becoming more complex, the need for information models is growing accordingly. Extensive research is currently underway to develop engineering data management capabilities and to understand the role of(More)
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