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Reversible control of adhesion is an important feature of many desired, existing, and potential systems, including climbing robots, medical tapes, and stamps for transfer printing. We present experimental and theoretical studies of pressure modulated adhesion between flat, stiff objects and elastomeric surfaces with sharp features of surface relief in(More)
Introduction Increased transistor leakage and performance variation present challenges for scaling of conventional six-transistor (6-T) SRAM cells. It has been recently shown that advanced transistor structures such as FinFETs [1] are more scalable and that FinFET-based 6-T SRAM cell designs offer improved static noise margin (SNM) with reduced variability,(More)
Negative-index metamaterials (NIMs) are engineered structures with optical properties that cannot be obtained in naturally occurring materials. Recent work has demonstrated that focused ion beam and layer-by-layer electron-beam lithography can be used to pattern the necessary nanoscale features over small areas (hundreds of µm(2)) for metamaterials with(More)
By pressure-controlled surface contact area, reversible adhesion can be achieved with strengths tunable by 3 orders of magnitude. This capability facilitates robust transfer printing of active materials and devices onto any surface for the development of stretchable and/or curvilinear electronics. The most important parameter in designing the surfaces of(More)
Transfer printing represents a set of techniques for deterministic assembly of micro-and nanomaterials into spatially organized, functional arrangements with two and three-dimensional layouts. Such processes provide versatile routes not only to test structures and vehicles for scientific studies but also to high-performance, heterogeneously integrated(More)
This letter describes the physics and application of an approach to transfer printing that utilizes targeted shear loading to modulate stamp adhesion in a controlled and repeatable fashion. Experimental measurements of pull-off forces as functions of shear and stamp dimension reveal key scaling properties and provide a means for comparison to theory and(More)
In this paper we present mechanics and materials aspects of elastomeric stamps that have angled features of relief on their surfaces, designed to enable control of adhesion strength by peeling direction, in a way that can be exploited in schemes for deterministic assembly by transfer printing. Detailed mechanics models capture the essential physics of(More)
This letter describes the physics and application of an approach to transfer printing that uses stamps with microstructures of relief embossed into their surfaces. Experimental measurement of velocity-dependent adhesive strength as a function of relief geometry reveals key scaling properties and provides a means for comparison to theoretical expectation.(More)
Applications of ferroelectric ceramics, ranging from components for sensors, memory devices, microelectromechanical systems, and energy convertors, all involve planar and rigid layouts. The brittle nature of such materials and their high-temperature processing requirements limit applications to devices that involve only very small mechanical deformations(More)