- Full text PDF available (0)
- This year (0)
- Last 5 years (6)
- Last 10 years (6)
Journals and Conferences
Determining the failure mechanism of a failing unit is becoming more expensive due to the tools for fault isolation. This paper will discuss the low cost and innovative way to implement Active Voltage Contrast (AVC) imaging fault isolation tool using the existing Scanning Electron Microscopy (SEM).
With the growing complexity of Integrated Circuit (IC) design having multiple metallization layers and copper wire bonded devices, most of the time backside fault isolation is a better approach. This paper evaluated wet chemical backside sample preparation as an alternative method for the traditional milling/polishing backside sample preparation.
Copper wire bonded products have brought difficulty to the failure analysis process, mainly because the existing decapsulation methods are not effective to preserve the physical properties of copper. This pushes the analysts to explore other techniques in order to improve the Copper decapsulation capability. There are a few decapsulation methods available… (More)
The growing demand for semiconductor products especially in the field of automotive industry calls for products that can withstand applications over wide range of temperature. Detailed design, robust reliability program and effective tri-temperature screening are some factors that need to be taken in consideration before a product can be introduced in the… (More)
Fuse trim links failure on analog devices can cause wrong Vref value, incorrect I2C address, incorrect frequency setting, etc. The fuse trim links failure can either be unblown or mistakenly blown during the trimming process. To validate, if blown or unblown, physical analysis is needed to check the trim links. This paper aims to discuss the different… (More)
Usual Failure Analysis steps may not guarantee the root cause for all failure mechanism type. It is inevitable that the failure may recover after decapsulation or backside grinding for some failure mechanism. The paper aims to discuss analysis approach used in resolving tilted die failure mechanism issue resulting to package re-design eliminating further… (More)