Andreas Vogl

We don’t have enough information about this author to calculate their statistics. If you think this is an error let us know.
Learn More
Access to the published version may require subscription. Abstract: Device encapsulation and packaging often constitutes a substantial part of the fabrication cost of micro electro-mechanical systems (MEMS) transducers and imaging sensor devices. In this paper, we propose a simple and cost-effective wafer-level capping method that utilizes a limited number(More)
This paper presents a method for modelling MEMS components whereby the designer can perform precise electrical, mechanical, and coupled electrical and mechanical simulations. Both surface and bulk micromachined components can be modelled at a geometrical level by defining simplified pseudo processes for a commercial CAD tool such as CovertorWare. The(More)
  • 1