Andreas Tockhorn

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— Communication networks today are facing an ever increasing network traffic as well as raising quality-of-service agreements, which together demand for high performance network routers. Since a router has to search a large set or routing rules for every incoming packet, it normally utilizes efficient search mechanisms, such as trees or hash tables. This(More)
With a fast rising productivity and even faster rising integration densities, i.e., design-productivity-gap, energy and power dissipation are critical topics in high level system design more than ever. Thermal aware system design, reliable power delivery, and the overall energy dissipation are only few crucial design properties. In this work we present a(More)
Due to aggressive scaling, reliability issues influence the design process of integrated circuits more and more. A well known technique to tackle these issues represents Triple Modular Redundancy (TMR). It strongly improves reliability of a design at the expense of at least tripled area and power consumption. In this contribution, we propose an enhanced TMR(More)
Because of the aggressive scaling of integrated circuits and the given limits of atomic scales, circuit designers have to become more and more aware of the arising reliability and yield concerns. So far, only very little research efforts have been put into low-level approaches for lifetime reliability, whereas lots of efforts have focused on soft-errors and(More)
—As transistor dimensions are shrinking into regions of only a few atomic layers, designers are faced with various problems including increased reliability and power issues. Since these problems are amplified by higher circuit temperatures, this paper proposes an approach for the fine-grained modeling of temperature distribution in many-core systems based(More)
—Progressive technology scaling raises the need for efficient VLSI design methods facing the increasing vulnerability to permanent physical defects, while considering power efficiency of resulting circuit implementations at the same time. Triple Modular Redundancy (TMR) represents a common method to encounter reliability problems, but has the drawback of(More)
— Because of the aggressive scaling into the nanometer regime, degradation due to wearout significantly impairs design parameters. For instance, such wearout is caused by gate oxide breakdown, which decreases the operating lifetime of integrated circuits to an extent that cannot be neglected by circuit designers to date. In this paper, we introduce an(More)
Increasing integration densities and the emergence of nanotechnology cause issues related to reliability and power consumption to become dominant factors for the design of modern multi-core systems. Since the arising problems are enforced by high circuit temperatures, monitoring and control of on-chip temperature profiles need to be considered during design(More)
Scaling device dimensions towards atomic scales leads to increased reliability and yield concerns which considerably affects the work of integrated circuit designers. Furthermore, the complexity of integrated systems increases which leads to a demand for tool assisted reliability insertion during the design process. Lots of research efforts have focused on(More)