Andreas Kyek

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Ochreous precipitates containing 5.5-69.8 g/kg As were isolated from mine drainage in Finland and were composed of schwertmannite, ferrihydrite, and goethite. Schwertmannite formation was favored at pH 3-4, but its structure was degraded at high As levels. A series of coprecipitates were therefore prepared from mixed iron arsenate/sulfate solutions to(More)
Different approaches for the prediction of average Silicon Nitride cap layer thickness for the Plasma Enhanced Chemical Vapor Deposition (PECVD) dual-layer metal passivation stack process are compared, based on metrology and production equipment Fault Detection and Classification (FDC) data. Various sets of FDC parameters are processed by different(More)
The quality of wafer production in semiconductor manufacturing cannot always be monitored by a costly physical measurement. Instead of measuring a quantity directly, it can be predicted by a regression method (Virtual Metrology). In this paper, a survey on regression methods is given to predict average Silicon Nitride cap layer thickness for the Plasma(More)
On the one hand, Industrie 4.0 has recently emerged as the keyword for increasing productivity in the 21st century. On the other hand, production scheduling in a Complex Job Shop (CJS) environment, such as wafer fabrication facilities, has drawn interest of researchers dating back to the 1950s [65, 18]. Although both research areas overlap, there seems to(More)
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