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Different approaches for the prediction of average Silicon Nitride cap layer thickness for the Plasma Enhanced Chemical Vapor Deposition (PECVD) dual-layer metal passivation stack process are compared, based on metrology and production equipment Fault Detection and Classification (FDC) data. Various sets of FDC parameters are processed by different(More)
On the one hand, Industrie 4.0 has recently emerged as the keyword for increasing productivity in the 21st century. On the other hand, production scheduling in a Complex Job Shop (CJS) environment, such as wafer fabrication facilities, has drawn interest of researchers dating back to the 1950s [65, 18]. Although both research areas overlap, there seems to(More)
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