Amlan Dasgupta

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This study presents simulation of damage initiation and propagation in solder joints with voids, under thermo-mechanical loading. A three dimensional, global-local, visco-plastic FEA is conducted for a CTBAG132 assembly under thermal cycling. The displacement results of the global FEA at the top and bottom of the critical solder ball are used as the(More)
  • A. Dasgupta
  • 2006
The computational engineering community is facing new modeling challenges because the advent of nanotechnology is clearly demonstrating the limitations of classical continuum mechanics. The discrete nature of matter leads to nonlinear and scale-dependent phenomena at the nanoscale, which cannot be captured in simple homogenization schemes such as those used(More)
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