Sorry, we do not have enough data to show an influence graph for this author.
- Full text PDF available (0)
Journals and Conferences
Die to die interconnection in wirebonding process these days is just common in particular to the mature packages using Gold (Au) wire as mean for interconnection. With the intense market competition to deliver a much competitive cost of the products more manufacturers, sub-contractors and even IDM (integrated device manufacturing) are now inclined with the… (More)