Aleksei V. Rakov

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Traveling-wave technique [1] has been proven as an effective way to extract dielectric constant (DK) and dissipation factor (DF) of laminate dielectrics on PCB test boards with unknown cross-sectional geometries and conductor surface roughness profiles. This technique is called S3 and is based on measuring the full set of complex S-parameters of a test(More)
Recently, an experiment-based traveling-wave technique to separate conductor loss from dielectric loss on printed circuit board (PCB) striplines, called the differential extrapolation roughness measurement (DERM), has been proposed. The further development of this procedure is presented in this paper. The new procedure is applied to both loss constant and(More)
Conductor (copper) foil surface roughness in printed circuit boards (PCBs) is inevitable due to adhesion with laminate dielectrics. Surface roughness limits data rates and frequency range of application of copper interconnects and affects signal integrity (SI) in high-speed electronic designs. In measurements of dielectric properties of laminate dielectrics(More)
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