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Electronic devices in contact or in close proximity to the human body can use its conductive properties to establish body coupled communication (BCC) between each other. This human centric communication paradigm can be used for wireless body-area networks to reduce the impact of interference on/from RF systems, to avoid the fading effect that the body has(More)
A solid-state silicon detector is a challenging device for microdosimetry, mainly because it can provide sensitive zones of the order of a micrometer. Moreover, these detectors are characterized by a high spatial and a good energy resolution. However, they may present some limitations, such as: (i) the minimum detectable energy which is limited by the(More)
This paper presents a synchronous 3D interconnection based on capacitive coupling. The designed link presents a power consumption of 0.128mW/pin@975Mbps/pin, overcoming standard I/O pads performance of two orders of magnitude. High bit-rate, reduced power consumption and electrode area down to 8/spl times/8/spl mu/m/sup 2/ enable the implementation of(More)
Reconfigurable processor architectures (RAs) have been proving as an effective way to couple significant performance improvements with severe energy constraints, such as those imposed by modern portable real-time applications. XiRisc is a VLIW RISC processor architecture featuring a reconfigurable dataflow-oriented functional unit, the so-called PiCoGA,(More)
Capacitive interconnections are very promising structures for high-speed and low-power signaling in 3D packages. Since the performance of AC links, in terms of Band-Width and Bit-Error-Rate (BER), depends on assembly and synchronization accuracy we performed a statistical analysis of assembly procedures and communication circuits. In this paper we present a(More)
A silicon device based on the monolithic silicon telescope technology coupled to a tissue-equivalent converter was proposed and investigated for solid state microdosimetry. The detector is constituted by a ΔE stage about 2 µm in thickness geometrically segmented in a matrix of micrometric diodes and a residual-energy measurement stage E about 500 µm in(More)
Chip-to-chip interconnection, based on wireless communication by capacitive coupling was investigated. This innovative approach will considerably reduce the pitch of the pin and strongly help in the implementation of a dense network of interconnects, while improving inter-chip bandwidth and power dissipation. The 3D integration technology based on aligned(More)
A 3D interconnection scheme based on capacitive coupling for high speed chip to chip communication has been implemented in a 0.13 mum CMOS process. This paper provides detailed design example for both synchronous and asynchronous transmitter and receiver circuits. The first approach shows with electrodes 15 times 15 mum<sup>2</sup> a wide range of operating(More)
3D contactless technology based on capacitive coupling represents a promising solution for high-speed and low power signaling in vertically integrated chips. AC coupled interconnects do not suffer from mechanical stress, and the parasitic load is much reduced when compared to standard DC solutions, such as wire bonding and micro bumps. Communication system(More)