Alain E. Kaloyeros

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Twenty-first century opportunities for GSI will be governed in part by a hierarchy of physical limits on interconnects whose levels are codified as fundamental, material, device, circuit, and system. Fundamental limits are derived from the basic axioms of electromagnetic, communication, and thermodynamic theories, which immutably restrict interconnect(More)
A de novo, genetically engineered 687 residue polypeptide expressed in E. coli has been found to form highly rectilinear, beta-sheet containing fibrillar structures. Tapping-mode atomic force microscopy, deep-UV Raman spectroscopy, and transmission electron microscopy definitively established the tendency of the fibrils to predominantly display an(More)
Viable methods for bacterial biofilm remediation require a fundamental understanding of biofilm mechanical properties and their dependence on dynamic environmental conditions. Mechanical test data, such as elasticity or adhesion, can be used to perform physical modelling of biofilm behaviour, thus enabling the development of novel remediation strategies. To(More)
Placing a layer of Ru atop a Pt anode increases the carbon monoxide tolerance of proton-exchange membrane fuel cells when oxygen is added to the fuel stream. Sputter-deposited Ru filter anodes composed of a single Ru layer and three Ru layers separated by Nafion-carbon ink, respectively, were compared to Pt, Pt:Ru alloy, and an ink-based Ru filter anodes.(More)
Recently, well-ordered biological materials have been exploited to pattern inorganic nanoparticles into linear arrays that are of particular interest for nanoelectronic applications. In this work, a de novo designed E. coli-expressed polypeptide (previously shown to form highly rectilinear, β-sheet-containing structures) operates as a template for divalent(More)
Results are presented from the photoluminescence properties of C-doped Si-rich thin film oxides implanted with Er, as investigated for various postdeposition implantation and subsequent annealing and passivation conditions. In particular, it was found that the near-infrared Er luminescence intensity can be increased by up to a factor of $4 after a(More)
The aggressive technology scaling in VLSI leads to decrease the size of chip. Such continual miniaturization of VLSI devices has strong impact on interconnects in several ways. Interconnects in high speed applications suffer from crosstalk, signal delay and ground noise, causing degradation of system performance. Thus interconnects are becoming a limiting(More)
The relative adhesion of two genetically engineered polypeptides termed as H6-(YEHK)x21-H6 and C6-(YEHK)X21-H6 has been investigated following growth and self-assembly on highly oriented pyrolytic graphite (HOPG), SiO2, Ni, and Au substrates to study covalent surface attachment via histidine (H) and cysteine (C) groups incorporated in the polypeptides. Both(More)
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