Akshay Prabhu

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This paper will discuss the solder joint reliability aspects of a new wafer level Chip Scale Package (CSP) form factor. The CSP requires no leadframe or interposer tooling. It is the same size as the die, and was originally developed for low-pin count analog devices for pitches from 0.8 mm down to 0.5 mm. The package has been demonstrated with eutectic(More)
Electrolytic CuNiAu over pad metallization (OPM) was qualified for high temperature gold wire bonding applications. Stability of the CuNiAu OPM metal stack was tested through extreme conditions, i.e.: ambient temperature 250 °C up to 4000 hours, with satisfactory results. Reliability of CuNiAu OPM was then confirmed in series of tests with ambient(More)
Electrolessly plated over pad metallization (OPM) was evaluated for high temperature gold wire bonding applications. Bonding strength, measured by wire bond bump shear test, of 4N gold wire on electroless OPMs, such as electroless nickel/immersion gold (ENIG), electroless nickel/electroless palladium (ENEP), and electroless nickel/electroless(More)
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