Ahmed Lakhsasi

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This paper proposes a control strategy based on artificial neural networks (ANN) for a positioning system with a flexible transmission element, taking into account Coulomb friction for both motor and load, and using a variable learning rate for adaptation to parameter changes and to accelerate convergence. The inverse model of this system is unrealizable.(More)
The estimation of the power loss and associated transient junction temperature of power devices has become a major issue with the increase of the current density and high switching frequency. Thus, the problem of power device temperature response to fast heat-source changes is of concern. This paper presents a new methodology, which describes the evolution(More)
We propose an artificial neural network based adaptive controller for a positioning system with a flexible transmission element, taking into account hard nonlinearities in the motor and load models. A feedforward compensation module (ANN/sub FF/) learns the approximate inverse dynamics of the system and a feedback controller (ANN/sub FBK/) compensates for(More)
During the development of a reconfigurable wafer-scale circuit board, the thermal design aspects have proved crucial to its reliable operation. Reducing thermally induced stress and preventing local overheating remain major concerns when optimizing the capabilities of the WaferBoard<sup>TM</sup> technology. This paper presents a thermal analysis of that(More)
Silicon integrated sensors for thermo-mechanical stress measurement in VLSI (very large scale integration) has been studied extensively in recent years due to the increasing complexity of modern semiconductor devices. As chip size has increased continuously to accommodate more functions in modern integrated circuits (IC) technology, the stress induced in a(More)
The impact of thermo-mechanical stress and distortion behavior is crucial during development of VLSI (very large scale integration) and WSI (wafer scale integration) circuits for their safe operation. The problem of the junction overheating and the thermal design aspect remains a major obstacle to the most required performances of electronic systems:(More)
Surface peaks thermal detection is necessary in modern VLSI circuits; their internal stress due to packaging combined with local self heating becomes serious and may result in large performance variation, circuit malfunction and even chip cracking. This paper presents the design of surface peaks thermal detector algorithm (SPTDA) with flexible modular-based(More)
Silicon integrated sensors for thermo-mechanical stress measurement in VLSI (very large scale integration) has been studied extensively in recent years due to the increasing complexity of modern semiconductor devices. As chip size has increased continuously to accommodate more functions in modern integrated circuits (IC) technology, the stress induced in a(More)
Surface peaks thermal detection is necessary in modern VLSI (very large scale integration) circuits; their internal stress due to packaging combined with local self heating becomes serious and may result in large performance variation, circuit malfunction and even chip cracking. This paper presents a VLSI thermal stress monitoring approach using GDS(More)
This paper contributes to the development of realistic methods which utilize finite element program to calculate eddy-current losses in laminated magnetic cores. The direct modeling method needs a fine mesh within each sheet and consequently results in large number of unknowns. To avoid modeling individually each sheet, we try to replace a number of sheets(More)
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