Agnieszka Samson

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The investigations presented in this paper illustrate the problem of modelling the average value of the convective heat transfer coefficient in the case of a free convection cooled power device with a heat sink. The total junction-to-ambient thermal resistance is dominated then by its component reflecting the heat exchange with the ambient at outer surfaces(More)
This paper discusses on the practical example of a power diode attached to a heat sink the problem of heat transfer coefficient temperature dependence and its importance for free convection cooled electronic systems. The average values of this coefficient are estimated from multiple measurements of device cooling curves performed for different device(More)
This paper presents the scope of applicability of Dual-Phase-Lag model in modern electronic structures. Moreover, the investigation of obligatory application of this model, instead of the classical approach based on Fourier-Kirchhoff model, to heat transfer modeling is included. Furthermore, the modified Fourier-Kirchhoff thermal model, containing the(More)
This paper demonstrates the temperature distribution in the structure which contains two platinum resistors. The Finite Element Method solution of Fourier-Kirchhoff and Dual-Phase-Lag models for two-dimensional problem is presented. Simulation results are compared and carefully discussed.
This paper demonstrates, based on a practical example of a test hybrid circuit, the importance of proper modeling of the heat transfer coefficient dependence on the surface temperature rise and fluid velocity in air cooled electronic systems. Hybrid circuits usually have large surface area and consequently important temperature gradients could occur in(More)
This paper discusses, based on a practical example, the problem of estimating the average radiation and convection heat transfer coefficient value in thermal models of electronic systems. The proposed empirical formulas are fitted to the results of temperature measurements taken for a power diode attached to a heat sink. The measurements were repeated in(More)
This paper includes the analyses related to the thermal model order reduction. The simplified, one-dimensional structure is investigated. The reduction technique based on the moment matching is employed. For this purpose, the Krylov-subspace-based model order reduction method is used. The generation of the reduced Dual-Phase-Lag heat transfer model is(More)
This paper compares different compact thermal models generated for a test hybrid circuit using the network identification by deconvolution method. The compact models are obtained both from measured device dynamic thermal responses and from heating curves simulated with a numerical FDM solver. The paper discusses also the influence of different simplifying(More)