Abhijit Dasgupta

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Thus there are a finite number of possible outcomes, say ω1, ω2, . . . , ωn, and each outcome ωi has a fixed non-trivial probability pi, so that P (ωi) = pi with 0 < pi < 1 for i = 1, 2, . . . , n, and ∑n i=1 pi = 1. The outcomes may be generated either automatically from a continuously running process, or on demand, say by pressing a button on the(More)
Title of Document: DEVELOPMENT OF ADVANCED WARPAGE MEASUREMENT SYSTEMS: SHADOW MOIRÉ WITH NONZERO TALBOT DISTANCE AND FAR INFRARED TWYMAN-GREEN INTERFEROMETRY Austin Bradley Cox Master of Science 2006 Directed By: Professor Bongtae Han Department of Mechanical Engineering Coefficient of thermal expansion mismatches in microelectronic devices induce(More)
Meandering beams, crenellated surfaces, and zigzag-shaped electrodes are employed as compliant elements in micro-scale applications ranging from springs attached to proof masses in micro-electro-mechanical systems (MEMS) to stretchable electrodes in flexible electronics and dielectric elastomer actuators. An understanding of how the meander shape affects(More)
Title of Thesis: Computer Aided Design of Side Actions for Injection Molding of Complex Parts Ashis Gopal Banerjee, Master of Science, 2006 Thesis directed by: Associate Professor Satyandra K. Gupta Department of Mechanical Engineering Often complex molded parts include undercuts, patches on the part boundaries that are not accessible along the main mold(More)
whose reliability testing work contributed significantly to the knowledge base for this document. We are grateful to the current and former members of the LED Systems Reliability Consortium, who offered their considerable time and expertise over the past three years to the development of this document.
Title of Thesis: HIGH ACCELERATIONS PRODUCED THROUGH SECONDARY IMPACT AND ITS EFFECT ON RELIABILITY OF PRINTED WIRING ASSEMBLIES Stuart Taylor Douglas, Master of Science, 2010 Thesis directed by: Professor Abhijit Dasgupta Department of Mechanical Engineering The focus of this thesis is the investigation of extremely high accelerations through secondary(More)
The functionality of next-generation DoD platforms, such as the Small Unmanned Ground Vehicles (SUGV) and Small Unmanned Arial Vehicles (SUAV), is strongly electronicsrich, Figure 1. Thus, the reliability of these systems will be strongly dependent on the reliability of the electronics. These electronic systems and the critical components in them experience(More)
Title of Dissertation: EFFECT OF SURFACE FINISHES AND INTERMETALLICS ON THE RELIABILITY OF SnAgCu INTERCONNECTS Yunqi Zheng, Doctor of Philosophy, 2005 Dissertation directed by: Associate Professor F. Patrick McCluskey Department of Mechanical Engineering Power semiconductor devices are used in a wide range of applications, including power supplies and(More)
Title of Thesis: THERMO-MECHANICAL ANALYSIS OF ENCAPSULATED BALL-WEDGE WIRE BONDS IN MICROELECTRONICS, USING RALEIGH-RITZ MODELING Krishna Kumar Jinka, Master of Science, 2006 Thesis directed By: Professor Abhijit Dasgupta Department of Mechanical Engineering This study addresses encapsulated wire bonds in chip-on-board (CoB) multi chip modules, which(More)
This paper presents the use of techniques for simulating product qualification as well as for product testing of electronic hardware to be used in the United States Marine Corp's Advanced Amphibious Assault Vehicle. The goal of integrating "up-front" virtual life assessment into the development environment is to increase overall product reliability and(More)